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Diamond Electroplating Wheel for Both Cutting and Polishing

Diamond Electroplating Wheel for Both Cutting and Polishing

[Features]
· For cutting and polishing.
· Offset type.
· It is possible to electrodeposit, cut and polish diamonds on the front and back of the board at the same time.
· For finish polishing.
[Applications]
· For cutting and grinding roof tile, marble, FRP, refractory brick, glass, granite, etc.
· Tool used: disc grinder.

Part Number

Configured Part Number is shown.

UFO-2

Features

●For cutting and polishing.
●It is offset type.
●For finish polishing.

Usage

●For cutting and polishing of roof tile, marble, FRP, refractory brick, glass and granite, etc.
●Working Tool: Disc grinder.

Specification

●Grain Size(#):60
●Outer Diameter x Thickness x Hole Diameter(mm):100 x 14 x 15
●SPQ(sheet):5
Part Number
UFO-2
Part NumberStandard Unit PriceMinimum order quantityVolume DiscountDays to Ship

MYR 555.32

1 Piece(s) 5 Day(s) or more

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  1. 1

Basic Information

Particle Size(#) 60 Outer Diameter(mm) 100 Thickness(mm) 14
Hole Diameter(mm) 15 Max. Rotational Speed(rpm) 15000 Trusco Code 171-4457
Mass(g) 91.8 Features For cutting and polishing. It is offset type. It is possible to electrodeposit, cut and polish diamonds on the front and back of the board at the same time. For final polishing. Application Polishing/cutting of roof tile, marble, FRP, refractory brick, glass, granite, etc. Tool used: Disc grinder.

Please check the type/dimensions/specifications of the part UFO-2 in the Diamond Electroplating Wheel for Both Cutting and Polishing series.

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