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High-Purity Silicon Wafer for Research 2-960-01

* Images are for illustrative purposes. The content and/or shape may differ depending on the selected model number.

High-Purity Silicon Wafer for Research
Part Number: 2-960-01

Standard Unit Price: MYR 419.23 Special Price MYR 419.23
Days to Ship: 8 Day(s)

It has been proven as a tool for research and development and supports various shapes and surface treatments, such as countersinking and drilling.

Specifications of 2-960-01

  • Product Type
    Material
  • Material
    Other
  • Size(mm)
    2 (Inch) x P Type
  • Manufacturer Product Name
    High-Purity Silicon Wafer for Research
  • Manufacturer Model
    2XP Type
  • Specifications
    Manufacturing method: CZ method; Surface direction: 100
  • Footnotes
    * The direction (cutting angle), OF position angle tolerance, and thickness tolerance can be processed at finer and higher precision, enabling accurate groove formation in etching. * Various shape processing and surface processing are possible. (Examples: Countersink parts, drilled parts, wafers with oxide films)
  • Particle
    Any particles
  • OF Length (mm) X Wafer Thickness
    17.5±2.5X280±25
  • Resistance Value
    0.1~100Ω・cm
  • OF Position
    110

Please check the type/dimensions/specifications of the part 2-960-01 in the High-Purity Silicon Wafer for Research series.

Products like this...

Part Number
2-960-02
2-960-04
2-960-05
2-960-06
Part NumberStandard Unit PriceMinimum order quantityVolume DiscountDays to ShipSize
(mm)
Manufacturer Model OF Length (mm) X Wafer Thickness

MYR 419.23

1 Piece(s) 8 Day(s) 2 (Inch) x N Type2XN Type17.5±2.5X280±25

MYR 409.27

1 Piece(s) 8 Day(s) 3 (Inch) x N Type3XN Type22.5±2.5X380±25

MYR 407.16

1 Piece(s) 8 Day(s) 4 (Inches) x P type4XP Type32.5±2.5X525±25

MYR 408.16

1 Piece(s) 8 Day(s) 4 (Inches) x N type4XN Type32.5±2.5X525±25

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